Soldering and Surface Mount Technology- Impact Score, Ranking, SJR, h-index, Citescore, Rating, Publisher, ISSN, and Other Important Details

About Soldering and Surface Mount Technology

Soldering and Surface Mount Technology is a journal published by Emerald Group Publishing Ltd.. This journal covers the area[s] related to Condensed Matter Physics, Electrical and Electronic Engineering, Materials Science (miscellaneous), etc. The coverage history of this journal is as follows: 1989-2022. The rank of this journal is 10789. This journal's impact score, h-index, and SJR are 2.76, 36, and 0.476, respectively. The ISSN of this journal is/are as follows: 09540911.

The best quartile of Soldering and Surface Mount Technology is Q2. This journal has received a total of 263 citations during the last three years (Preceding 2022).

Soldering and Surface Mount Technology Impact Score 2022-2023

The latest impact score (IS) of the Soldering and Surface Mount Technology is 2.76. It is computed in the year 2023 as per its definition and based on Scopus data. 2.76

It is increased by a factor of around 1.25, and the percentage change is 82.78% compared to the preceding year 2021, indicating a rising trend.

The impact score (IS), also denoted as the Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.

Prediction of Soldering and Surface Mount Technology Impact Score 2023

Impact Score 2022 of Soldering and Surface Mount Technology is 2.76. If a similar upward trend continues, IS may increase in 2023 as well.

Soldering and Surface Mount Technology h-index

 

The h-index of Soldering and Surface Mount Technology is 36. By definition of the h-index, this journal has at least 36 published articles with more than 36 citations.

What is h-index?

The h-index (also known as the Hirsch index or Hirsh index) is a scientometric parameter used to evaluate the scientific impact of the publications and journals. It is defined as the maximum value of h such that the given Journal has published at least h papers and each has at least h citations.

Soldering and Surface Mount Technology ISSN

The International Standard Serial Number (ISSN) of Soldering and Surface Mount Technology is/are as follows: 09540911.

The ISSN is a unique 8-digit identifier for a specific publication like Magazine or Journal. The ISSN is used in the postal system and in the publishing world to identify the articles that are published in journals, magazines, newsletters, etc. This is the number assigned to your article by the publisher, and it is the one you will use to reference your article within the library catalogues.

ISSN code (also called as "ISSN structure" or "ISSN syntax") can be expressed as follows: NNNN-NNNC
Here, N is in the set {0,1,2,3...,9}, a digit character, and C is in {0,1,2,3,...,9,X}

Soldering and Surface Mount Technology Ranking and SCImago Journal Rank (SJR)

The Soldering and Surface Mount Technology is ranked 10789 among 27955 Journals, Conferences, and Book Series. As per SJR, this journal is ranked 0.476.

SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.

Soldering and Surface Mount Technology Publisher

The publisher of Soldering and Surface Mount Technology is Emerald Group Publishing Ltd.. The publishing house of this journal is located in the United Kingdom. Its coverage history is as follows: 1989-2022.

Call For Papers (CFPs)

Please check the official website of this journal to find out the complete details and Call For Papers (CFPs).

Abbreviation

The International Organization for Standardization 4 (ISO 4) abbreviation of Soldering and Surface Mount Technology is Solder. Surf. Mt. Technol.. ISO 4 is an international standard which defines a uniform and consistent system for the abbreviation of serial publication titles, which are published regularly. The primary use of ISO 4 is to abbreviate or shorten the names of scientific journals using the technique of List of Title Word Abbreviations (LTWA).

As ISO 4 is an international standard, the abbreviation ('Solder. Surf. Mt. Technol.') can be used for citing, indexing, abstraction, and referencing purposes.

How to publish in Soldering and Surface Mount Technology

If your area of research or discipline is related to Condensed Matter Physics, Electrical and Electronic Engineering, Materials Science (miscellaneous), etc., please check the journal's official website to understand the complete publication process.

Acceptance Rate

There are several factors that influence the acceptance rate of any academic journal. Here are some critical parameters that are considered while calculating the acceptance rate:

• Interest/demand of researchers/scientists for publishing in a specific journal/conference.
• The complexity of the peer review process and timeline.
• Time taken from draft submission to final publication.
• Number of submissions received and acceptance slots
• And Many More.

The simplest way to find out the acceptance rate or rejection rate of a Journal/Conference is to check with the journal's/conference's editorial team through emails or through the official website.

Credits and Sources

• Scimago Journal & Country Rank (SJR), https://www.scimagojr.com/
• Journal Impact Factor, https://clarivate.com/
• Issn.org, https://www.issn.org/
• Scopus, https://www.scopus.com/