IEEE Transactions on Components, Packaging and Manufacturing Technology- Impact Score, Ranking, SJR, h-index, Citescore, Rating, Publisher, ISSN, and Other Important Details

About IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology is a journal published by Institute of Electrical and Electronics Engineers Inc.. This journal covers the area[s] related to Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Industrial and Manufacturing Engineering, etc. The coverage history of this journal is as follows: 2011-2022. The rank of this journal is 8327. This journal's impact score, h-index, and SJR are 2.52, 59, and 0.615, respectively. The ISSN of this journal is/are as follows: 21563950.

The best quartile of IEEE Transactions on Components, Packaging and Manufacturing Technology is Q2. This journal has received a total of 1856 citations during the last three years (Preceding 2022).

IEEE Transactions on Components, Packaging and Manufacturing Technology Impact Score 2022-2023

The latest impact score (IS) of the IEEE Transactions on Components, Packaging and Manufacturing Technology is 2.52. It is computed in the year 2023 as per its definition and based on Scopus data. 2.52

It is increased by a factor of around 0.26, and the percentage change is 11.5% compared to the preceding year 2021, indicating a rising trend.

The impact score (IS), also denoted as the Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.

Prediction of IEEE Transactions on Components, Packaging and Manufacturing Technology Impact Score 2023

Impact Score 2022 of IEEE Transactions on Components, Packaging and Manufacturing Technology is 2.52. If a similar upward trend continues, IS may increase in 2023 as well.

IEEE Transactions on Components, Packaging and Manufacturing Technology h-index

 

The h-index of IEEE Transactions on Components, Packaging and Manufacturing Technology is 59. By definition of the h-index, this journal has at least 59 published articles with more than 59 citations.

What is h-index?

The h-index (also known as the Hirsch index or Hirsh index) is a scientometric parameter used to evaluate the scientific impact of the publications and journals. It is defined as the maximum value of h such that the given Journal has published at least h papers and each has at least h citations.

IEEE Transactions on Components, Packaging and Manufacturing Technology ISSN

The International Standard Serial Number (ISSN) of IEEE Transactions on Components, Packaging and Manufacturing Technology is/are as follows: 21563950.

The ISSN is a unique 8-digit identifier for a specific publication like Magazine or Journal. The ISSN is used in the postal system and in the publishing world to identify the articles that are published in journals, magazines, newsletters, etc. This is the number assigned to your article by the publisher, and it is the one you will use to reference your article within the library catalogues.

ISSN code (also called as "ISSN structure" or "ISSN syntax") can be expressed as follows: NNNN-NNNC
Here, N is in the set {0,1,2,3...,9}, a digit character, and C is in {0,1,2,3,...,9,X}

IEEE Transactions on Components, Packaging and Manufacturing Technology Ranking and SCImago Journal Rank (SJR)

The IEEE Transactions on Components, Packaging and Manufacturing Technology is ranked 8327 among 27955 Journals, Conferences, and Book Series. As per SJR, this journal is ranked 0.615.

SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.

IEEE Transactions on Components, Packaging and Manufacturing Technology Publisher

The publisher of IEEE Transactions on Components, Packaging and Manufacturing Technology is Institute of Electrical and Electronics Engineers Inc.. The publishing house of this journal is located in the United States. Its coverage history is as follows: 2011-2022.

Call For Papers (CFPs)

Please check the official website of this journal to find out the complete details and Call For Papers (CFPs).

Abbreviation

The International Organization for Standardization 4 (ISO 4) abbreviation of IEEE Transactions on Components, Packaging and Manufacturing Technology is IEEE Trans. Compon. Packag. Manuf. Technol.. ISO 4 is an international standard which defines a uniform and consistent system for the abbreviation of serial publication titles, which are published regularly. The primary use of ISO 4 is to abbreviate or shorten the names of scientific journals using the technique of List of Title Word Abbreviations (LTWA).

As ISO 4 is an international standard, the abbreviation ('IEEE Trans. Compon. Packag. Manuf. Technol.') can be used for citing, indexing, abstraction, and referencing purposes.

How to publish in IEEE Transactions on Components, Packaging and Manufacturing Technology

If your area of research or discipline is related to Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Industrial and Manufacturing Engineering, etc., please check the journal's official website to understand the complete publication process.

Acceptance Rate

There are several factors that influence the acceptance rate of any academic journal. Here are some critical parameters that are considered while calculating the acceptance rate:

• Interest/demand of researchers/scientists for publishing in a specific journal/conference.
• The complexity of the peer review process and timeline.
• Time taken from draft submission to final publication.
• Number of submissions received and acceptance slots
• And Many More.

The simplest way to find out the acceptance rate or rejection rate of a Journal/Conference is to check with the journal's/conference's editorial team through emails or through the official website.

Credits and Sources

• Scimago Journal & Country Rank (SJR), https://www.scimagojr.com/
• Journal Impact Factor, https://clarivate.com/
• Issn.org, https://www.issn.org/
• Scopus, https://www.scopus.com/